CHIP

The products we develop are Bare Die (Bond Wire and Flip Chip) functions.

The chips can be used by customers integrating them into their modules or other types of packaging alternatives.

We offer design service getting the integrated functionality working together.

 800/900/1800/1900/2100 VCO -170dBc/Hz@20MHz(900) chip => pbvcoc-1

3G GaAs HBT Power amplifier in 3x3mm QFN example during development phase

SiGe, GaAs MesFet/PHemt, Si-CMOS, SOI-CMOS Silicon SOI or Saphire we can deliver have the knowledge.